| Product Range |
1) CEM-1, CEM-3,
FR4
2) High Frequency Circuit Materials : Arlon, Rogers
3) Halogen –Free Material |
| Laminate Thickness |
0.4 ~ 3.0mm 2 double
sided to 12-layered |
| Cu Foil Thickness
|
18mil to 144mil (0.5oz
~ 4oz) |
| Minimum Finished Hole
|
0.1mm (4 mil) |
| Minimum Line Width |
0.07mm (3 mil) |
| Minimum Air Gap |
0.07mm (3 mil) |
| Fine SMD Pitch |
0.20mm (8 mil) |
| Maximum Panel Size |
457mm x 609mm (18”x24”)
|
| Metal Surface Finishing
|
1) Electroless Ni
/ Au Plating
2) Soft/Hard Au Plating
3) Carbon Ink / Silver Ink
4) Pre-Flux
5) Entek
6) Lead-Free Hot Air Levelling
7) Immersion Gold |
| Solder-mask Finishing
|
1) Wet Film
2) Thermal Cure Solder-mask
3) UV Solder-mark
4) Peelable Solder-mask |
| Profile |
1) CNC Routing
2) V-Cut
3) Mould-Die Punching |
| RoHs Standard |
Passed with SGS Sample
Approved |
